JPH0424859B2 - - Google Patents
Info
- Publication number
- JPH0424859B2 JPH0424859B2 JP28822785A JP28822785A JPH0424859B2 JP H0424859 B2 JPH0424859 B2 JP H0424859B2 JP 28822785 A JP28822785 A JP 28822785A JP 28822785 A JP28822785 A JP 28822785A JP H0424859 B2 JPH0424859 B2 JP H0424859B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- overcoat layer
- wiring pattern
- conductive adhesive
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145827A JPS62145827A (ja) | 1987-06-29 |
| JPH0424859B2 true JPH0424859B2 (en]) | 1992-04-28 |
Family
ID=17727475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28822785A Granted JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145827A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386624A (en) * | 1993-07-06 | 1995-02-07 | Motorola, Inc. | Method for underencapsulating components on circuit supporting substrates |
| US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
| JP4191567B2 (ja) * | 2003-09-18 | 2008-12-03 | 株式会社リコー | 導電性接着剤による接続構造体及びその製造方法 |
-
1985
- 1985-12-20 JP JP28822785A patent/JPS62145827A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62145827A (ja) | 1987-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6147311A (en) | Multi layer circuit board using anisotropic electroconductive adhesive layer and method for producing same | |
| US5283947A (en) | Method of mounting electronic components on a circuit board | |
| JPS63310581A (ja) | フイルム体及びそれを用いた素子並びにその製造方法 | |
| JPH0424859B2 (en]) | ||
| JPS6127089Y2 (en]) | ||
| JPH0521900Y2 (en]) | ||
| JPH08202844A (ja) | 電子機器及びその製造方法 | |
| JPH10261852A (ja) | ヒートシールコネクタとフレキシブル配線板 | |
| JP2001332846A (ja) | 電子部品の実装方法および実装体 | |
| JP3122170B2 (ja) | 電子回路装置及びその製造方法 | |
| JPH0274092A (ja) | 実装体の製造方法 | |
| JPS6030195A (ja) | リ−ド接続方法 | |
| JPH10261853A (ja) | 基板端子の構造およびそれを具備したテープキャリアパッケージ、プリント配線板 | |
| JP2501668Y2 (ja) | 表面実装用電気部品 | |
| JPS60140791A (ja) | 配線基板 | |
| JPS6149499A (ja) | フレキシブル多層配線基板 | |
| JPS6347157B2 (en]) | ||
| JPS5821391A (ja) | 電子部品の実装装置 | |
| JP2891254B2 (ja) | 面付実装用電子部品 | |
| JP2003100367A (ja) | 導電性接着剤、この接着剤を用いた回路基板間の接続方法および回路基板間の接続構造 | |
| JPH0543311B2 (en]) | ||
| JP3174975B2 (ja) | 電子部品搭載装置 | |
| JPH01251786A (ja) | 電子回路装置 | |
| JPS63128393A (ja) | 電子部品と配線パタ−ンとの接続方法 | |
| JPS63137460A (ja) | 半導体チツプ搭載用プリント配線板 |